Cover of Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu: Packaging of High Power Semiconductor Lasers

Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu Packaging of High Power Semiconductor Lasers

Price for Eshop: 4210 Kč (€ 168.4)

VAT 0% included

New

E-book delivered electronically online

E-Book information

Springer New York

2014

PDF
How do I buy e-book?

978-1-4614-9263-4

1-4614-9263-7

Annotation

This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Ask question

You can ask us about this book and we'll send an answer to your e-mail.