Cover of Hong Liang, David Craven: Tribology In Chemical-Mechanical Planarization

Hong Liang, David Craven Tribology In Chemical-Mechanical Planarization

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CRC Press

2005

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978-1-4200-2839-3

1-4200-2839-1

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The role that friction and contact play in the processes of wear and planarization on material surfaces is central to the understanding of Chemical-Mechanical planarization (CMP) technology, particularly when applied to nanosurfaces. Tribology in Chemical-Mechanical Planarization presents a detailed account of the CMP process in a language that is

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