Cover of Fred W. Kear: Hybrid Assemblies and Multichip Modules

Fred W. Kear Hybrid Assemblies and Multichip Modules

Price for Eshop: 1632 Kč (€ 65.3)

VAT 0% included

New

E-book delivered electronically online

E-Book information

CRC Press

2020

EPub
How do I buy e-book?

296

978-1-00-014780-3

1-00-014780-0

Annotation

Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications.;Examining the current state of hybrid assembly technology, Hybrid Assemblies and Multichip Modules: provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components.;Focusing primarily on electronic assemblies that use ceramic substrates, Hybrid Assemblies and Multichip Modules should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.

Ask question

You can ask us about this book and we'll send an answer to your e-mail.