Cover of Daniel Lu (EDT), C.P. Wong (EDT): Materials for Advanced Packaging

Daniel Lu (EDT), C.P. Wong (EDT) Materials for Advanced Packaging

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Springer US

2008

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978-0-387-78219-5

0-387-78219-2

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

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