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E-Books - Mechanics of solids

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Alok Sinha

Vibration of Mechanical Systems

Price for Eshop: 1436 Kč (€ 57.4)

Format: E-Book, Publisher: Cambridge University Press

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Alok Sinha

Vibration of Mechanical Systems

Price for Eshop: 1436 Kč (€ 57.4)

Format: E-Book, Publisher: Cambridge University Press

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Dinker B. Sirdeshmukh, Lalitha Sirdeshmukh, K.G. Subhadra

Atomistic Properties of Solids

Price for Eshop: 3647 Kč (€ 145.9)

Format: E-Book, Publisher: Springer Berlin Heidelberg

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Evro Wee Sit (EDT)

Sensors and Instrumentation, Volume 5

Proceedings of the 34th IMAC, A Conference and Exposition on Structural Dynamics 2016

Price for Eshop: 3647 Kč (€ 145.9)

Format: E-Book, Publisher: Springer International Publishing

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Evro Wee Sit (EDT), Chad Walber (EDT), Patrick Walter (EDT), Steve Seidlitz (EDT)

Sensors and Instrumentation, Volume 5

Proceedings of the 35th IMAC, A Conference and Exposition on Structural Dynamics 2017

Price for Eshop: 3647 Kč (€ 145.9)

Format: E-Book, Publisher: Springer International Publishing

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T.G. Sitharam (EDT), Ravi Jakka (EDT), Sreevalsa Kolathayar (EDT)

Latest Developments in Geotechnical Earthquake Engineering and Soil Dynamics

Price for Eshop: 5618 Kč (€ 224.7)

Format: E-Book, Publisher: Springer Nature Singapore

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Dariusz Skibicki

Phenomena and Computational Models of Non-Proportional Fatigue of Materials

Price for Eshop: 1267 Kč (€ 50.7)

Format: E-Book, Publisher: Springer International Publishing

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Balzej T. Skoczen

Compensation Systems for Low Temperature Applications

Price for Eshop: 3647 Kč (€ 145.9)

Format: E-Book, Publisher: Springer Berlin Heidelberg

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Jacek J. Skrzypek (EDT), Franco Rustichelli (EDT)

Innovative Technological Materials

Structural Properties by Neutron Scattering, Synchrotron Radiation and Modeling

Price for Eshop: 2520 Kč (€ 100.8)

Format: E-Book, Publisher: Springer Berlin Heidelberg

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Jacek J. Skrzypek, Artur Ganczarski

Modeling of Material Damage and Failure of Structures

Theory and Applications

Price for Eshop: 3647 Kč (€ 145.9)

Format: E-Book, Publisher: Springer Berlin Heidelberg

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