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E-Books - Materials science
Nanofabrication
Principles, Capabilities and Limits
Price for Eshop: 3097 Kč (€ 123.9)
Format: E-Book, Publisher: Springer International Publishing
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Add to Cart InformationSolution Processed Metal Oxide Thin Films for Electronic Applications
Price for Eshop: 4493 Kč (€ 179.7)
Format: E-Book, Publisher: Elsevier Science
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Add to Cart InformationMicroscopy of Semiconducting Materials 1987, Proceedings of the Institute of Physics Conference, Oxford University, April 1987
Price for Eshop: 1632 Kč (€ 65.3)
Format: E-Book, Publisher: CRC Press
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Add to Cart InformationMicroscopy of Semiconducting Materials 1983, Third Oxford Conference on Microscopy of Semiconducting Materials, St Catherines College, March 1983
Price for Eshop: 7181 Kč (€ 287.2)
Format: E-Book, Publisher: CRC Press
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Add to Cart InformationMicroscopy of Semiconducting Materials 1983, Third Oxford Conference on Microscopy of Semiconducting Materials, St Catherines College, March 1983
Price for Eshop: 7181 Kč (€ 287.2)
Format: E-Book, Publisher: CRC Press
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Add to Cart InformationMicroscopy of Semiconducting Materials 1987, Proceedings of the Institute of Physics Conference, Oxford University, April 1987
Price for Eshop: 1632 Kč (€ 65.3)
Format: E-Book, Publisher: CRC Press
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Add to Cart InformationMicroscopy of Semiconducting Materials
Proceedings of the 14th Conference, April 11-14, 2005, Oxford, UK
Price for Eshop: 5055 Kč (€ 202.2)
Format: E-Book, Publisher: Springer Berlin Heidelberg
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Add to Cart InformationMicroscopy of Semiconducting Materials 2007
Proceedings of the 15th Conference, 2-5 April 2007, Cambridge, UK
Price for Eshop: 5055 Kč (€ 202.2)
Format: E-Book, Publisher: Springer Netherlands
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Add to Cart InformationSemiconductor Quantum Science and Technology
Price for Eshop: 5841 Kč (€ 233.6)
Format: E-Book, Publisher: Elsevier Science
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Add to Cart InformationProceedings of the 3rd RILEM Spring Convention and Conference (RSCC 2020)
Volume 4: Shift to a Circular Economy
Price for Eshop: 5618 Kč (€ 224.7)
Format: E-Book, Publisher: Springer International Publishing
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